Investigation of novel inorganic resist materials for EUV lithography

Marie E. Krysak; James M. Blackwell; Steve E. Putna; Michael J. Leeson; Todd R. Younkin; Shane Harlson; Kent Frasure; Florian Gstrein

doi:10.1117/12.2046677

17 April 2014 Investigation of novel inorganic resist materials for EUV lithography

Marie E. Krysak, James M. Blackwell, Steve E. Putna, Michael J. Leeson, Todd R. Younkin, Shane Harlson, Kent Frasure, Florian Gstrein

Author Affiliations +

Proceedings Volume 9048, Extreme Ultraviolet (EUV) Lithography V; 904805 (2014) https://doi.org/10.1117/12.2046677
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

Recently, both PSI¹ and ASML² illustrated champion EUVL resolution using slow, non-chemically amplified inorganic resists. However, the requirements for EUVL manufacturing require simultaneous delivery of high resolution, good sensitivity, and low line edge/width roughness (LER/LWR) on commercial grade hardware. As a result, we believe that new classes of materials should be explored and understood. This paper focuses on our efforts to assess metal oxide based nanoparticles as novel EUV resists³. Various spectroscopic techniques were used to probe the patterning mechanism of these materials. EUV exposure data is presented to investigate the feasibility of employing inorganic materials as viable EUV resists.

Citation Download Citation

Marie E. Krysak, James M. Blackwell, Steve E. Putna, Michael J. Leeson, Todd R. Younkin, Shane Harlson, Kent Frasure, and Florian Gstrein "Investigation of novel inorganic resist materials for EUV lithography", Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 904805 (17 April 2014); https://doi.org/10.1117/12.2046677

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