High-power fiber-coupled diode lasers with superior brightness, efficiency, and reliability

Keith Kennedy; Marty Hemenway; Wolfram Urbanek; Kylan Hoener; Kirk Price; Ling Bao; David Dawson; Manoj Kanskar; Jim Haden

doi:10.1117/12.2041186

7 March 2014 High-power fiber-coupled diode lasers with superior brightness, efficiency, and reliability

Keith Kennedy, Marty Hemenway, Wolfram Urbanek, Kylan Hoener, Kirk Price, Ling Bao, David Dawson, Manoj Kanskar, Jim Haden

Author Affiliations +

Proceedings Volume 8965, High-Power Diode Laser Technology and Applications XII; 89650D (2014) https://doi.org/10.1117/12.2041186
Event: SPIE LASE, 2014, San Francisco, California, United States

Abstract

Advances in high performance fiber coupled diode lasers continue to enable new applications as well as strengthen existing uses through progressive improvements in power and brightness [1]. These improvements are most notable in multi-kW direct diode systems and kW fiber laser platforms that effectively transform better beam quality into superior system performance and in DPSS (Diode pumped solid state) application striving to scale TEM00 (fundamental transverse mode) power. We report on our recent single-emitter based fiber-coupled product platform, the elementTM, that addressed these applications at 8xx/9xx nm with optical powers over 200W in a range of fiber core sizes down to 105um and 0.14NA (Numerical Aperture). The product is a culmination of numerous packaging improvements: improving wall plug efficiencies (~50% electrical-to-optical) while improving volume manufacturability, enabling lower costs, improving usable chip brightness by, < 20% over previous generation chips, and increasing the reliable output power to 15W per chip. We additionally report on current developments to extend the power of the product platform to as high as 300W. This will be realized primarily through new chip architectures projected to further increase the useable chip brightness by an additional 20 % and correspondingly scaling reliable output powers. Second order improvements are proposed in packaging enhancements that capitalize on the increased chip power and brightness as well as expand the package’s thermal capabilities. Finally, an extended performance roadmap will translate expected power advances and increasing volumes into a projection of relative $/W decreases over the next several years.

Citation Download Citation

Keith Kennedy, Marty Hemenway, Wolfram Urbanek, Kylan Hoener, Kirk Price, Ling Bao, David Dawson, Manoj Kanskar, and Jim Haden "High-power fiber-coupled diode lasers with superior brightness, efficiency, and reliability", Proc. SPIE 8965, High-Power Diode Laser Technology and Applications XII, 89650D (7 March 2014); https://doi.org/10.1117/12.2041186

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