Nondestructive characterization of residual stress within CMOS-based composite microcantilevers

Adrian A. Rendon-Hernandez; Sergio Camacho-Leon; Sergio O. Martinez-Chapa

doi:10.1117/12.2009903

11 April 2013 Nondestructive characterization of residual stress within CMOS-based composite microcantilevers

Adrian A. Rendon-Hernandez, Sergio Camacho-Leon, Sergio O. Martinez-Chapa

Proceedings Volume 8694, Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security 2013; 869405 (2013) https://doi.org/10.1117/12.2009903
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2013, San Diego, California, United States

Abstract

Residual stress can affect the performance of thin-film micromachined structures and lead to curling in cantilevers as well as distortion in the frequency of resonant devices. As the origin of residual stress is dependent on the fabrication processes, a nondestructive method for characterization of residual stress independent of processes conditions is desirable for supporting the design of microcantilever-based microsystems. In this paper we present a nondestructive characterization of the residual stress within composite microcantilever beams providing valuable insights toward predicting their deflection profile after mechanical releasing from the substrate. The approach relies on the assumption of a linear gradient stress and a quadratic deflection profile across a composite microcantilever.

Citation Download Citation

Adrian A. Rendon-Hernandez, Sergio Camacho-Leon, and Sergio O. Martinez-Chapa "Nondestructive characterization of residual stress within CMOS-based composite microcantilevers", Proc. SPIE 8694, Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security 2013, 869405 (11 April 2013); https://doi.org/10.1117/12.2009903

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