Lens heating impact analysis and controls for critical device layers by computational method

Du Hyun Beak; Jin Phil Choi; Tony Park; Young Sun Nam; Young Seog Kang; Chan-Hoon Park; Ki-Yeop(Chris) Park; Chang-Hoon Ryu; Wenjin Huang; Ki-Ho Baik

doi:10.1117/12.2012135

12 April 2013 Lens heating impact analysis and controls for critical device layers by computational method

Du Hyun Beak, Jin Phil Choi, Tony Park, Young Sun Nam, Young Seog Kang, Chan-Hoon Park, Ki-Yeop(Chris) Park, Chang-Hoon Ryu, Wenjin Huang, Ki-Ho Baik

Author Affiliations +

Proceedings Volume 8683, Optical Microlithography XXVI; 86831Q (2013) https://doi.org/10.1117/12.2012135
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

We report that, based on our experimental data, lens heating (LH) impact on wafer image can be effectively controlled by using a computational method (cASCAL) on critical device layers with no request on tool time. As design rule shrinks down, LH control plays a key role in preventing the image deterioration caused by the LH-induced wavefront distortion during exposure. To improve LH prediction accuracy, 3-dimension structure of mask stack (M3D) is considered in calculating the electro-magnetic (EM) field that passes through the mask for full chip. Additionally, lens specific calibration (LSC) is performed on individual scanners to take the lens-to-lens variation into account. In data comparisons, we show that cASCAL performs very well as an ASCAL substitute, and that M3D and LSC improve the LH prediction accuracy of cASCAL.

Citation Download Citation

Du Hyun Beak, Jin Phil Choi, Tony Park, Young Sun Nam, Young Seog Kang, Chan-Hoon Park, Ki-Yeop(Chris) Park, Chang-Hoon Ryu, Wenjin Huang, and Ki-Ho Baik "Lens heating impact analysis and controls for critical device layers by computational method", Proc. SPIE 8683, Optical Microlithography XXVI, 86831Q (12 April 2013); https://doi.org/10.1117/12.2012135

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