Nanoscale modulus and surface chemistry characterization for collapse free resists

Prashant K. Kulshreshtha; Ken Maruyama; Sara Kiani; Dominik Ziegler; James Blackwell; Deidre Olynick; Paul D. Ashby

doi:10.1117/12.2011657

18 April 2013 Nanoscale modulus and surface chemistry characterization for collapse free resists

Prashant K. Kulshreshtha, Ken Maruyama, Sara Kiani, Dominik Ziegler, James Blackwell, Deidre Olynick, Paul D. Ashby

Proceedings Volume 8681, Metrology, Inspection, and Process Control for Microlithography XXVII; 86810O (2013) https://doi.org/10.1117/12.2011657
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

One of the key challenges to high resolution resist patterning is pattern collapse. Using a new scanning probe microscopy (SPM), Peak Force^TM tapping, we map nano-mechanical properties-- modulus, adhesion, and dissipation-- of the exposed/developed resist structures with sub-10 nm resolution. Properties are compared across a carbon based negative resist with and without cross-linking. The SPM technique reveals that cross-linking significantly enhances the mechanical properties to give a champion resolution of sub 20 nm half-pitch in a chemically amplified negative resist system. Beyond mechanical properties, surface morphology and redistribution kinetics were examined using complementary techniques and reveal additional benefits with cross-linking.

Citation Download Citation

Prashant K. Kulshreshtha, Ken Maruyama, Sara Kiani, Dominik Ziegler, James Blackwell, Deidre Olynick, and Paul D. Ashby "Nanoscale modulus and surface chemistry characterization for collapse free resists", Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86810O (18 April 2013); https://doi.org/10.1117/12.2011657

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