Paper
14 March 2013 Bend-size reduction on the SOI rib waveguide platform
Timo Aalto, Matteo Cherchi, Mikko Harjanne, Sami Ylinen, Markku Kapulainen
Author Affiliations +
Proceedings Volume 8629, Silicon Photonics VIII; 86290D (2013) https://doi.org/10.1117/12.2002349
Event: SPIE OPTO, 2013, San Francisco, California, United States
Abstract
The minimum bending radius of optical waveguides is typically the most important parameter that defines the footprint and cost of a photonic integrated circuit. In optical fibers and in planar waveguides with equally large mode fields (~10 μm) the bending radii are typically in the cm-scale. The main advantage of using a high index waveguide core with a thickness below 1 μm is the ability to realise single-mode bends with bending radii of just a few micrometers. In this paper we review the dependence of the minimum bending radius on the size and shape of waveguides with the main emphasis on silicon-on-insulator (SOI) waveguides. Then we present simulation and measurement results from advanced waveguide bends and mirrors that have been integrated with 4-10 μm thick single-mode SOI waveguides. We show that multi-step patterning and novel designs allow the reduction of the bending radius by up to three orders of magnitude while also reducing the bending losses by approximately one order of magnitude when compared to traditional rib waveguide bends on 4 μm SOI. This allows to use the μm-scale SOI waveguides for making almost as compact photonic integrated circuits as those based on sub-μm SOI waveguides.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Timo Aalto, Matteo Cherchi, Mikko Harjanne, Sami Ylinen, and Markku Kapulainen "Bend-size reduction on the SOI rib waveguide platform", Proc. SPIE 8629, Silicon Photonics VIII, 86290D (14 March 2013); https://doi.org/10.1117/12.2002349
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KEYWORDS
Waveguides

Mirrors

Silicon

Cladding

Photonic integrated circuits

Etching

Neodymium

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