A photo-sensor on thin polysilicon membrane embedded in wafer level package LED

Jin Kwan Kim; Hee Chul Lee

doi:10.1117/12.921623

11 May 2012 A photo-sensor on thin polysilicon membrane embedded in wafer level package LED

Jin Kwan Kim, Hee Chul Lee

Proceedings Volume 8431, Silicon Photonics and Photonic Integrated Circuits III; 843121 (2012) https://doi.org/10.1117/12.921623
Event: SPIE Photonics Europe, 2012, Brussels, Belgium

Abstract

A wafer level packaging LED with photo-sensor which is fabricated on thin poly-silicon membrane located on the corner of silicon cavity is presented in this paper. The wafer substrate was fabricated with (100) orientation silicon wafer and a cavity was etched on the top of the wafer with wet chemical anisotropic etching process for mounting a LED chip. A thin polysilicon membrane was fabricated on the corner of the cavity and a MSM (Metal Semiconductor Metal) type photo-sensor was fabricated on the thin polysilicon membrane. The photo-sensor fabrication and LED packaging were completed on wafer level. The embedded photo-sensor in a wafer level packaging LED is designed to measure light intensity of a LED. The membrane structure photo-sensor can sense the light of the mounted LED directly, so it can measure accurate light intensity of the wafer level packing LED.

Citation Download Citation

Jin Kwan Kim and Hee Chul Lee "A photo-sensor on thin polysilicon membrane embedded in wafer level package LED", Proc. SPIE 8431, Silicon Photonics and Photonic Integrated Circuits III, 843121 (11 May 2012); https://doi.org/10.1117/12.921623

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