Paper
20 April 2011 Investigation on accuracy of process overlay measurement
Chan Hwang, Jeongjin Lee, Seungyoon Lee, Jeongho Yeo, Yeonghee Kim, Hongmeng Lim, Dongsub Choi
Author Affiliations +
Abstract
The shrinkage of design rule necessitated corresponding tighter overlay control. However, in advanced applications, the extension of current technology may not be able to meet the control requirement, consequently, additional breakthroughs are required. In this study, we investigated methods to enhance the overlay control, approaches by extraction of real overlay error out of overlay measurement. So far, only the destructive inspections like vertical SEM have enabled us to measure real misalignment. But, a concept of non-destructive method is proposed in this paper, extracting vertical information from the results of multiple measurements with various measurement conditions, keys or recipes. With this proposed method, the measurement accuracy can be improved and we can enable a new knob for overlay control.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chan Hwang, Jeongjin Lee, Seungyoon Lee, Jeongho Yeo, Yeonghee Kim, Hongmeng Lim, and Dongsub Choi "Investigation on accuracy of process overlay measurement", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79711F (20 April 2011); https://doi.org/10.1117/12.880299
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Cited by 6 scholarly publications.
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KEYWORDS
Overlay metrology

Metrology

Image processing

Semiconducting wafers

Scanners

Photoresist processing

Inspection

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