Factors affecting the reliability of the ceramic dielectric body of multi layer ceramic capacitors (MLCCs) were explored
for several capacitor sizes. Preliminary results indicate a correlation between the materials used for capacitor termination
and the emergence of cracks. The authors varied the termination material, shape, and thickness of MLCCs. Under
regimes in which boards were subjected to cyclic bending, vibrations, temperature cycling, and high-g loading, cracks
have tended to appear on the bottom of the capacitor in proximity to the termination. Flexible termination materials
corresponded to reduced crack formation at low strain rates.
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