Paper
25 November 2009 A trichromatic phosphor-free white light-emitting diode by using adhesive bonding scheme
D. X. Chuai, X. Guo, B. L. Guan, J. L. Zhang, G. D. Shen
Author Affiliations +
Proceedings Volume 7635, Display, Solid-State Lighting, Photovoltaics, and Optoelectronics in Energy; 76350L (2009) https://doi.org/10.1117/12.852061
Event: Asia Communications and Photonics, 2009, Shanghai, Shanghai , China
Abstract
A trichromatic phosphor-free white light-emitting diode (LED) has been implemented by using adhesive bonding scheme. The device has been operated as a three-terminal device with independent electrical control of an AlGaInPbased red LED chip and a GaN-based dual-wavelength (blue and green) LED chip. As 25mA and 60mA was injected into the red and blue-green LED chips at room temperature respectively, white light emission could be observed with CIE chromaticity coordinates (0.3330,0.3241), correlated color temperature Tc=5467K and optical power Φe=2.223mW. The electroluminescence measurements also show that the emitted white light is composed of blue, green and red lights, centered at around 452nm, 517nm and 632nm. The fabrication and the electrical and optical performances of such white LED were described.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D. X. Chuai, X. Guo, B. L. Guan, J. L. Zhang, and G. D. Shen "A trichromatic phosphor-free white light-emitting diode by using adhesive bonding scheme", Proc. SPIE 7635, Display, Solid-State Lighting, Photovoltaics, and Optoelectronics in Energy, 76350L (25 November 2009); https://doi.org/10.1117/12.852061
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KEYWORDS
Light emitting diodes

Electroluminescence

Adhesives

Semiconducting wafers

Electrodes

Control systems

Gallium arsenide

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