Resolving contact conflict for double patterning split

N. Zeggaoui; V. Farys; Y. Trouiller; E. Yesilada; F. Robert; J. Belledent; M. Besacier

doi:10.1117/12.829762

29 September 2009 Resolving contact conflict for double patterning split

N. Zeggaoui, V. Farys, Y. Trouiller, E. Yesilada, F. Robert, J. Belledent, M. Besacier

Proceedings Volume 7488, Photomask Technology 2009; 74882K (2009) https://doi.org/10.1117/12.829762
Event: SPIE Photomask Technology, 2009, Monterey, California, United States

Abstract

Double patterning (DP) is one of the main options to print devices with half pitch less than 45nm. The basis of DP is to decompose a design into two masks. In this work we focus on the decomposition of the contact pattern layer. Contacts with pitch less than a split pitch are assigned to opposite masks corresponding to different exposures. However, there exist contact pattern configurations for which features can not be assigned to opposite masks. Such contacts are flagged as color conflicts. With the help of design of manufacturing (DFM), the contact conflicts can be reduced through redesign. However, even the state of the art DFM redesign solution will be limited by area constraints and will introduce delays to the design flow. In this paper, we propose an optical method for contact conflicts treatment. We study the impact of the split on imaging by comparing inverse lithography technology (ILT), optical proximity correction (OPC) and source mask co-optimization (SMO) techniques. The ability of these methods to solve some split contacts conflicts in double patterning are presented.

Citation Download Citation

N. Zeggaoui, V. Farys, Y. Trouiller, E. Yesilada, F. Robert, J. Belledent, and M. Besacier "Resolving contact conflict for double patterning split", Proc. SPIE 7488, Photomask Technology 2009, 74882K (29 September 2009); https://doi.org/10.1117/12.829762

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KEYWORDS

Double patterning technology

Optical proximity correction

Photomasks

Source mask optimization

Optical lithography

Design for manufacturing

Feature extraction

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