Determining thermal and mechanical properties of polyimide using the DIC method

Tao Hua; Huimin Xie; Bing Pan; Pengwan Chen; Qingming Zhang; Fenglei Huang

doi:10.1117/12.839329

27 August 2009 Determining thermal and mechanical properties of polyimide using the DIC method

Tao Hua, Huimin Xie, Bing Pan, Pengwan Chen, Qingming Zhang, Fenglei Huang

Proceedings Volume 7375, ICEM 2008: International Conference on Experimental Mechanics 2008; 737552 (2009) https://doi.org/10.1117/12.839329
Event: International Conference on Experimental Mechanics 2008 and Seventh Asian Conference on Experimental Mechanics, 2008, Nanjing, China

Abstract

Polyimide (PI) is widely used in the aerospace and microelectronics industry and engineering due to its excellent electric and mechanical properties; however, the high thermal expansion of the PI causes the problem on the thermal expansion mismatching. A new type of PI with P-Phenylene diamine as diamine monomer is proposed to reduce the thermal expansion. The coefficient of thermal expansion (CTE) and the Young's module of this PI films are studied in this paper using DIC method. The CTE of the new type PI films is about 21x10^-6/°C, which is greatly reduced. The successful results demonstrated the feasibility of DIC method to measure the thermal and mechanical properties of films.

Citation Download Citation

Tao Hua, Huimin Xie, Bing Pan, Pengwan Chen, Qingming Zhang, and Fenglei Huang "Determining thermal and mechanical properties of polyimide using the DIC method", Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 737552 (27 August 2009); https://doi.org/10.1117/12.839329

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