Examining internal gas compositions of a variety of microcircuit package types and ages with a focus on sources of internal moisture

R. K. Lowry; R. C. Kullberg

doi:10.1117/12.807970

9 February 2009 Examining internal gas compositions of a variety of microcircuit package types and ages with a focus on sources of internal moisture

R. K. Lowry, R. C. Kullberg

Author Affiliations +

Proceedings Volume 7206, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII; 720606 (2009) https://doi.org/10.1117/12.807970
Event: SPIE MOEMS-MEMS: Micro- and Nanofabrication, 2009, San Jose, California, United States

Abstract

The primary cause of corrosion, stiction or other failure mechanisms within hermetically sealed enclosures has historically been viewed as due to increases in internal moisture concentrations. It has historically been postulated that the primary source of moisture in these enclosures is the failure to achieve hermeticity at seal, or the loss of hermeticity post-seal. This postulation is the basis for failure analysis and mitigation both in the appropriate standards like MILSTD- 883 and in industrial QA procedures. Empirical observation of many data sets over the past 20+ years shows that this postulation does not always hold up in practice. The purpose of the current work is to test this postulation through the analysis of archival microelectronic packages and data sets of various ages. Internal gas composition data for three different sets of packages totaling 165 units is reviewed. Of these, 63 were noncompliant (>0.50v%) on internal moisture, but only 8 (12.7%) showed an internal gas composition "signature" consistent with air leaking into the enclosure. These data suggest that leaks play a minor role in gas composition change within enclosures and that outgassing from materials is the principal contributor to internal moisture concentrations and the failure modes they induce.

Citation Download Citation

R. K. Lowry and R. C. Kullberg "Examining internal gas compositions of a variety of microcircuit package types and ages with a focus on sources of internal moisture", Proc. SPIE 7206, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII, 720606 (9 February 2009); https://doi.org/10.1117/12.807970

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