Paper
23 February 2009 Sharpened transparent micronozzle fabrication for cell membrane piercing
E. M. Campo, M. J. Lopez-Martinez, E. Fernández, E. Ibañez, L. Barros, C. Nogues, J. Esteve, J. A. Plaza
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Abstract
Sharpened cantilevered nozzles were fabricated combining microsystem technologies and focused ion beam micromachining. Micronozzles consist of silicon chips with silicon oxide microchannels whose micronozzles were reshaped using Focused Ion Beam. Micronozzle body was defined by an aluminum sacrificial layer patterned over a silicon wafer. This layer was surrounded by a deposited silicon oxide structural layer. The chip is defined by a silicon deep reactive ion etching through the wafer. This process releases part of the metal line forming a cantilevered micronozzle. Sharp reshaped micronozzles were achieved by focused ion beam milling. Mechanical tests of silicon oxide nozzles still containing the aluminum sacrificial layer were performed by cell piercing. In some instances, zona pellucida and membrane were crossed without cell lysis, and micronozzles remained intact.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
E. M. Campo, M. J. Lopez-Martinez, E. Fernández, E. Ibañez, L. Barros, C. Nogues, J. Esteve, and J. A. Plaza "Sharpened transparent micronozzle fabrication for cell membrane piercing", Proc. SPIE 7204, Micromachining and Microfabrication Process Technology XIV, 720407 (23 February 2009); https://doi.org/10.1117/12.809427
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Cited by 1 scholarly publication.
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KEYWORDS
Silicon

Oxides

Ion beams

Aluminum

Deep reactive ion etching

Semiconducting wafers

Manufacturing

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