Micro-scale large-area UV laser processing

Ludolf Herbst; Jan Brune

doi:10.1117/12.807828

24 February 2009 Micro-scale large-area UV laser processing

Ludolf Herbst, Jan Brune

Proceedings Volume 7202, Laser-based Micro- and Nanopackaging and Assembly III; 72020M (2009) https://doi.org/10.1117/12.807828
Event: SPIE LASE: Lasers and Applications in Science and Engineering, 2009, San Jose, California, United States

Abstract

UV lasers are well-established sources for a wide variety of micro-machining applications. The small wavelength makes them ideal for processing of small features or to modify thin surfaces. Especially short pulse UV lasers are ideal for ablation of various materials, e. g., polyimide, parylene, PMMA, copper, gold and diamond. Furthermore these lasers are used for silicon annealing and patterning of fine circuitries to various substrates. The demand for smaller feature sizes of micro-mechanical and micro-electronic devices set new requirements in regard to resolution, throughput and overall cost efficiency of the process. In this paper, high-power excimer laser micro-machining and annealing relevant applications will be presented and discussed.

Citation Download Citation

Ludolf Herbst and Jan Brune "Micro-scale large-area UV laser processing", Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 72020M (24 February 2009); https://doi.org/10.1117/12.807828

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