Evaluation of 32nm advanced immersion lithography pellicles

N. Zhou; K. Racette; M. Hibbs; T. Mizoguchi; D. Hasselbeck; M. Barrett; R. Nolan; F. Houle; J. Ritter; A. Wagner; M. Caterer

doi:10.1117/12.801663

17 October 2008 Evaluation of 32nm advanced immersion lithography pellicles

N. Zhou, K. Racette, M. Hibbs, T. Mizoguchi, D. Hasselbeck, M. Barrett, R. Nolan, F. Houle, J. Ritter, A. Wagner, M. Caterer

Author Affiliations +

Proceedings Volume 7122, Photomask Technology 2008; 71220B (2008) https://doi.org/10.1117/12.801663
Event: SPIE Photomask Technology, 2008, Monterey, California, United States

Abstract

Advanced immersion lithography utilizes higher numerical aperture (NA) stepper lenses resulting in higher angles of light illumination through photomasks. Transmission in conventional pellicles (830 nm thickness) is generally maximized at 0 degree illumination and decreases significantly at the higher angles. Most pellicle suppliers have developed thinner pellicle membranes (~280 nm) which allow considerably improved transmission of light at angles up to 20 degrees. In addition, aluminum frames have been shortened, potentially allowing inspection closer to the inside of the frame and reduced mask flatness distortion upon pellicle mount. Suppliers have also developed advanced adhesives which reduce outgassing even beyond the low levels obtained with current 45 nm pellicles. In this paper, advanced immersion pellicles from several suppliers are evaluated and compared with conventional 45 nm pellicles for the following quality parameters: physical durability, foreign material, ease of demounting and glue removal, chemical outgassing, mask flatness distortion and susceptibility to radiation damage. Improvements in mask inspection and pellicle optical transmission at higher incident angles are also evaluated and are discussed.

Citation Download Citation

N. Zhou, K. Racette, M. Hibbs, T. Mizoguchi, D. Hasselbeck, M. Barrett, R. Nolan, F. Houle, J. Ritter, A. Wagner, and M. Caterer "Evaluation of 32nm advanced immersion lithography pellicles", Proc. SPIE 7122, Photomask Technology 2008, 71220B (17 October 2008); https://doi.org/10.1117/12.801663

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available