Paper
1 April 2008 Proposal for determining exposure latitude requirements
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Abstract
To determine the magnitude of the exposure latitude required for a process to be manufacturable, additional factors are considered that have a similar relationship between linewidth variation and image log-slope. Such parameters include resist thickness, flare, post-exposure bake temperature, and line-edge roughness. To obtain consistency between theory and experiment it is necessary to use the resist-edge log-slope generalization of image log-slope. Inclusion of these additional factors increases the required exposure latitude five to six times more than would be considered necessary from exposure tool dose control alone.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Harry J. Levinson, Yuansheng Ma, Marcel Koenig, Bruno La Fontaine, and Rolf Seltmann "Proposal for determining exposure latitude requirements", Proc. SPIE 6924, Optical Microlithography XXI, 69241J (1 April 2008); https://doi.org/10.1117/12.772711
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KEYWORDS
Critical dimension metrology

Line edge roughness

Photomasks

Semiconducting wafers

Diffusion

Image processing

Lithography

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