Interactions of double patterning technology with wafer processing, OPC and design flows

Kevin Lucas; Chris Cork; Alex Miloslavsky; Gerry Luk-Pat; Levi Barnes; John Hapli; John Lewellen; Greg Rollins; Vincent Wiaux; Staf Verhaegen

doi:10.1117/12.778267

20 March 2008 Interactions of double patterning technology with wafer processing, OPC and design flows

Kevin Lucas, Chris Cork, Alex Miloslavsky, Gerry Luk-Pat, Levi Barnes, John Hapli, John Lewellen, Greg Rollins, Vincent Wiaux, Staf Verhaegen

Author Affiliations +

Proceedings Volume 6924, Optical Microlithography XXI; 692403 (2008) https://doi.org/10.1117/12.778267
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

Double patterning technology (DPT) is one of the main options for printing logic devices with half-pitch less than 45nm; and flash and DRAM memory devices with half-pitch less than 40nm. DPT methods decompose the original design intent into two individual masking layers which are each patterned using single exposures and existing 193nm lithography tools. The results of the individual patterning layers combine to re-create the design intent pattern on the wafer. In this paper we study interactions of DPT with lithography, masks synthesis and physical design flows. Double exposure and etch patterning steps create complexity for both process and design flows. DPT decomposition is a critical software step which will be performed in physical design and also in mask synthesis. Decomposition includes cutting (splitting) of original design intent polygons into multiple polygons where required; and coloring of the resulting polygons. We evaluate the ability to meet key physical design goals such as: reduce circuit area; minimize rework; ensure DPT compliance; guarantee patterning robustness on individual layer targets; ensure symmetric wafer results; and create uniform wafer density for the individual patterning layers.

Citation Download Citation

Kevin Lucas, Chris Cork, Alex Miloslavsky, Gerry Luk-Pat, Levi Barnes, John Hapli, John Lewellen, Greg Rollins, Vincent Wiaux, and Staf Verhaegen "Interactions of double patterning technology with wafer processing, OPC and design flows", Proc. SPIE 6924, Optical Microlithography XXI, 692403 (20 March 2008); https://doi.org/10.1117/12.778267

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