Effects of bake temperature and surface modifications on hardmask materials for trilayer applications

Charles J. Neef; Jim Finazzo; Cheryl Nesbit; Michael Weigand

doi:10.1117/12.771701

26 March 2008 Effects of bake temperature and surface modifications on hardmask materials for trilayer applications

Charles J. Neef, Jim Finazzo, Cheryl Nesbit, Michael Weigand

Proceedings Volume 6923, Advances in Resist Materials and Processing Technology XXV; 692331 (2008) https://doi.org/10.1117/12.771701
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

A comparison of bake temperature effects on two hardmask materials was performed. The first hardmask was a silicon-based material, BSI.M06092K, and the second was a titanium-based material, BSI.S07051. The materials have inherently different chemistries that performed differently as bake temperature was varied. BSI.M06092K undergoes condensation of silanols on the wafer during baking and BSI.S07051 undergoes removal of the ligand followed by condensation during baking. In general, the performance of BSI.M06092K showed little or no dependency on bake temperature. BSI.S07051 showed an increase in contact angle with water, slower etch rates, and square profiles as bake temperature increased.

Citation Download Citation

Charles J. Neef, Jim Finazzo, Cheryl Nesbit, and Michael Weigand "Effects of bake temperature and surface modifications on hardmask materials for trilayer applications", Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 692331 (26 March 2008); https://doi.org/10.1117/12.771701

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