Paper
20 March 2008 Shaped beam technique using a novel 3rd-order imaging approach
Tadashi Kotsugi, Takashi Fuse, Hidetoshi Kinoshita, N. William Parker
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Abstract
We investigate a new technique for high current density beam formation called 3rd order imaging. This technique has two advantages: 1) increasing the beam current without beam blurring, and 2) producing a desired beam shape, such as a square or rectangle. Thus, it can significantly decrease writing times in Electron Beam Direct Writing (EBDW). These advantages are realized by using a patterned beam-defining aperture (PBDA) whose patterned openings work with the spherical aberration in the objective lens to generate the final beam shape. The PBDA transmits rays if they fall within the desired shape at the wafer, while blocking rays which would fall outside the desired shape. We have obtained beam line profiles and two-dimensional beam shapes experimentally. The 3rd-order imaging beam current density is seven times larger than that of a beam shaped by the conventional aperture. The experimental beam profile and the calculated result are in good agreement. The experimental two-dimensional shapes reproduce the calculated beam shapes, thereby verifying the theory of 3rd-order imaging. This technique is a potential solution to break through the technological impasse of high current density versus high resolution.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tadashi Kotsugi, Takashi Fuse, Hidetoshi Kinoshita, and N. William Parker "Shaped beam technique using a novel 3rd-order imaging approach", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69211V (20 March 2008); https://doi.org/10.1117/12.771753
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Cited by 4 scholarly publications.
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KEYWORDS
Beam shaping

Semiconducting wafers

Electron beam direct write lithography

Objectives

Monochromatic aberrations

Solids

Electron beams

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