TCAD tool for innovative MEMS and MOEMS: an all-in-one solution

U. Triltsch; S. Büttgenbach

doi:10.1117/12.773043

26 February 2008 TCAD tool for innovative MEMS and MOEMS: an all-in-one solution

U. Triltsch, S. Büttgenbach

Proceedings Volume 6882, Micromachining and Microfabrication Process Technology XIII; 68820G (2008) https://doi.org/10.1117/12.773043
Event: MOEMS-MEMS 2008 Micro and Nanofabrication, 2008, San Jose, California, United States

Abstract

In this paper we present a TCAD tool for MEMS, which combines process and layout design and provides links to behavioral modeling tools as well as to specialized modules for the optimized design of single components. There is a large amount of new fabrication technologies available which make the design of highly innovative MEMS and MOEMS possible. The design of such systems not only incorporates the layout of masks but also involves the composition of a flawless process chain. TCAD tools for MEMS available today do mostly not support the design of new fabrication processes together with behavioral simulation and layout design. Therefore, there is a need for a methodical approach to component-design, which leads an engineer from single components to a system ready for fabrication. Based on a conceptual model for the design process the latest version of the modular software environment BICEP³S (Braunschweigs Integrated CAD-Environment for Product Planning Process Simulation) is explained. The concept and data model of building blocks on component level, that act as knowledge containers for fabrication ready functional elements of microsystems, are shown in detail. As the detailed simulation of single process steps is crucial in fabrication oriented design cycles, we present an atomistic etch-simulator as one example for specialized simulation modules of our design environment.

Citation Download Citation

U. Triltsch and S. Büttgenbach "TCAD tool for innovative MEMS and MOEMS: an all-in-one solution", Proc. SPIE 6882, Micromachining and Microfabrication Process Technology XIII, 68820G (26 February 2008); https://doi.org/10.1117/12.773043

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available