New approach for 1w high output LED package using 3D lead frame

Zihua Liu

doi:10.1117/12.756339

15 January 2008 New approach for 1w high output LED package using 3D lead frame

Zihua Liu

Proceedings Volume 6841, Solid State Lighting and Solar Energy Technologies; 68410R (2008) https://doi.org/10.1117/12.756339
Event: Photonics Asia 2007, 2007, Beijing, China

Abstract

Currently, to package high power white LED almost use the manner of coating Phosphor over 40mil blue chip, in order to reduce heat dissipation, a new solution was brought about How to integrate small dies to achieve large die effect? This report will bring up a new manner to bond chips in vertical surface, break the traditionary packing manner.

Citation Download Citation

Zihua Liu "New approach for 1w high output LED package using 3D lead frame", Proc. SPIE 6841, Solid State Lighting and Solar Energy Technologies, 68410R (15 January 2008); https://doi.org/10.1117/12.756339

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