Paper
25 February 2008 Analyzing the influence of camera temperature on the image acquisition process
Author Affiliations +
Proceedings Volume 6805, Three-Dimensional Image Capture and Applications 2008; 68050X (2008) https://doi.org/10.1117/12.766442
Event: Electronic Imaging, 2008, San Jose, California, United States
Abstract
This article presents an analysis of thermal influences on the image acquisition process of an electronic camera. It is shown that temperature changes lead to thermal expansion of the mechanical camera components and thus to a displacement of the camera sensor and/or to a displacement of the center of projection. This change in the imaging geometry leads to changing camera parameters which have to be adjusted if the camera is used for high accurate measurements. The slight change in the imaging geometry can be determined by an analysis of the optical flow of a static calibration pattern. The dependency between temperature change and the change of the camera parameters can be modeled using methods from linear time invariant system theory. Once the model is determined for a specific camera it can be used for adjusting the camera parameters according to the current temperature and thus increasing the accuracy of an optical measurement device.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Holger Handel "Analyzing the influence of camera temperature on the image acquisition process", Proc. SPIE 6805, Three-Dimensional Image Capture and Applications 2008, 68050X (25 February 2008); https://doi.org/10.1117/12.766442
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Cameras

Image processing

Temperature metrology

Image acquisition

Information technology

3D image processing

Electronic imaging

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