Paper
9 January 2008 High sensitivity capacitive MEMS microphone with spring supported diaphragm
Norizan Mohamad, Pio Iovenitti, Thurai Vinay
Author Affiliations +
Proceedings Volume 6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV; 68001T (2008) https://doi.org/10.1117/12.758987
Event: SPIE Microelectronics, MEMS, and Nanotechnology, 2007, Canberra, ACT, Australia
Abstract
Capacitive microphones (condenser microphones) work on a principle of variable capacitance and voltage by the movement of its electrically charged diaphragm and back plate in response to sound pressure. There has been considerable research carried out to increase the sensing performance of microphones while reducing their size to cater for various modern applications such as mobile communication and hearing aid devices. This paper reviews the development and current performance of several condenser MEMS microphone designs, and introduces a microphone with spring supported diaphragm to further improve condenser microphone performance. The numerical analysis using Coventor FEM software shows that this new microphone design has a higher mechanical sensitivity compared to the existing edge clamped flat diaphragm condenser MEMS microphone. The spring supported diaphragm is shown to have a flat frequency response up to 7 kHz and more stable under the variations of the diaphragm residual stress. The microphone is designed to be easily fabricated using the existing silicon fabrication technology and the stability against the residual stress increases its reproducibility.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Norizan Mohamad, Pio Iovenitti, and Thurai Vinay "High sensitivity capacitive MEMS microphone with spring supported diaphragm", Proc. SPIE 6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV, 68001T (9 January 2008); https://doi.org/10.1117/12.758987
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CITATIONS
Cited by 9 scholarly publications.
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KEYWORDS
Microelectromechanical systems

Silicon

Capacitance

Finite element methods

Scanning probe lithography

Numerical analysis

Semiconducting wafers

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