Etching lithium niobate during Ti diffusion process

V. Sivan; L. Bui; D. Venkatachalam; S. Bhargava; T. Priest; A. Holland; A. Mitchell

doi:10.1117/12.759612

9 January 2008 Etching lithium niobate during Ti diffusion process

V. Sivan, L. Bui, D. Venkatachalam, S. Bhargava, T. Priest, A. Holland, A. Mitchell

Proceedings Volume 6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV; 68001J (2008) https://doi.org/10.1117/12.759612
Event: SPIE Microelectronics, MEMS, and Nanotechnology, 2007, Canberra, ACT, Australia

Abstract

We present a novel method of etching lithium niobate during the Ti diffusion process. A hypothesis for this etching process is explained by defining the kinetics of the Ti diffusion process as an electrochemical reaction. The Ti ions diffuse into the X cut LiNbO₃ crystal by swapping with Nb ions generating an electric field. Investigations were carried out by placing a bare LiNbO₃ wafer on top of the Ti patterned LiNbO₃ substrate during the diffusion process in a wet oxygen atmosphere. The built-in electric field during the Ti diffusion process is neutralised with the bare LiNbO₃ placed on top and is evident from the material removal that takes place from the top bare substrate and deposited on the bottom substrate were Ti is diffused. Hence the bare substrate is etched in the regions where Ti is present on the bottom substrate. Features can be arbitrarily defined (using Ti etching) and can have dimensions of 1 micron or smaller. Etch depths of the order of 1 micron have been demonstrated while maintaining smooth surfaces. The crystalline nature of the etched surface is analysed using X-ray diffraction techniques. The refractive index measurement and the surface roughness of the etched surface are also presented.

Citation Download Citation

V. Sivan, L. Bui, D. Venkatachalam, S. Bhargava, T. Priest, A. Holland, and A. Mitchell "Etching lithium niobate during Ti diffusion process", Proc. SPIE 6800, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV, 68001J (9 January 2008); https://doi.org/10.1117/12.759612

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