Process analysis of silica ablation by F2 laser for MOEMS

Weilai Li; Desheng Jiang; Yutang Dai

doi:10.1117/12.782844

21 November 2007 Process analysis of silica ablation by F₂ laser for MOEMS

Weilai Li, Desheng Jiang, Yutang Dai

Proceedings Volume 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems; 67241B (2007) https://doi.org/10.1117/12.782844
Event: 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Large Mirrors and Telescopes, 2007, Chengdu, China

Abstract

Silica is a good material of MOEMS, however, it is difficult to be micro-processed to form a complicated appearance. Introduced in this paper is process analysis of fluorine (F₂) 157-nm laser micro-ablating silica. The interaction and mechanism of ablative photo decomposition between the photons of 157-nm laser and silica are discussed in detail. To test 157-nm silica ablating effect, the profile of micro holes on the end cross section of silica photonic crystal fiber (PCF) was employed under the exposure of 157-nm beam, to quantitatively analyze the ablating depth and degree. The results show that under 7.9eV photon energy of 157-nm laser, the defect formations in silica are accumulated to produce a large quantity of free electrons. Meanwhile, the dopants in silica fiber or glass considerably reduce the breakdown threshold. Because the rate of single-photon absorption outclasses the rate of multi-photon absorption, it can be inferred that the mechanism of interactions between 157-nm laser and silica is a process of single-photon absorption of electron-avalanche. The actual ablating velocity 210nm/pulse showed that the 157-nm laser could be absorbed strongly by silica material. It also illustrated that there did be thermal process during the ablation, however, because the velocity of damage caused by ablating was very fast, the heat was therefore limited. A good quality of ablating result could be ensured.

Citation Download Citation

Weilai Li, Desheng Jiang, and Yutang Dai "Process analysis of silica ablation by F₂ laser for MOEMS", Proc. SPIE 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 67241B (21 November 2007); https://doi.org/10.1117/12.782844

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