Presentation of silicon platforms for wireless advanced networks of sensors for aeronautics application

K. Moreau; C. Ruby; S. Rolet; B. Petitjean; V. Rouet

doi:10.1117/12.721864

15 May 2007 Presentation of silicon platforms for wireless advanced networks of sensors for aeronautics application

K. Moreau, C. Ruby, S. Rolet, B. Petitjean, V. Rouet

Proceedings Volume 6589, Smart Sensors, Actuators, and MEMS III; 65890F (2007) https://doi.org/10.1117/12.721864
Event: Microtechnologies for the New Millennium, 2007, Maspalomas, Gran Canaria, Spain

Abstract

The MEDEA+ SWANS (Silicon Platform for Wireless Advanced Networks of Sensors) project aims at defining a generic silicon platform, integrating analogue and digital Intellectual Property (IP) blocks for wireless sensor nodes technology. This generic platform will be used in various applications, such as transportation (aeronautics, automotive), homeland security, environmental and health/fitness. In the aeronautical application, the platform monitors, continuously, aircraft structures to detect whether a crack exists or not and process the data in real time, inside the platform. Measurements are provided by an inductive sensor glued on a structure and are acquired during flights. The sensor impedance (real and imaginary parts) varies depending on the state of the part area on which it is stuck. For example, this sensor aims at monitoring the further evolution of the crack too. The data are transmitted from the sensor to an ARM microcontroller through an electronic conditioner. Then, they are analysed and stored in a non volatile memory. Data measurements are collected by a RF transmission, every 2 or 4 months. A 3D stack platform demonstrator that allows the use of different technologies, will be realised, fully tested and characterised.

Citation Download Citation

K. Moreau, C. Ruby, S. Rolet, B. Petitjean, and V. Rouet "Presentation of silicon platforms for wireless advanced networks of sensors for aeronautics application", Proc. SPIE 6589, Smart Sensors, Actuators, and MEMS III, 65890F (15 May 2007); https://doi.org/10.1117/12.721864

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