Thermal and mechanical joints to cryo-cooled silicon monochromator crystals

A. MacDowell; S. Fakra; G. Morrison

doi:10.1117/12.697083

29 August 2006 Thermal and mechanical joints to cryo-cooled silicon monochromator crystals

A. MacDowell, S. Fakra, G. Morrison

Proceedings Volume 6317, Advances in X-Ray/EUV Optics, Components, and Applications; 63171F (2006) https://doi.org/10.1117/12.697083
Event: SPIE Optics + Photonics, 2006, San Diego, California, United States

Abstract

We describe the performance of various materials used as the thermal interface between silicon to silicon and silicon to copper joints when operated at ~120K and loaded with ~20 watts of thermal power. We find that only the indium based silicon-to-silicon joint is reliable.

Citation Download Citation

A. MacDowell, S. Fakra, and G. Morrison "Thermal and mechanical joints to cryo-cooled silicon monochromator crystals", Proc. SPIE 6317, Advances in X-Ray/EUV Optics, Components, and Applications, 63171F (29 August 2006); https://doi.org/10.1117/12.697083

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