Paper
21 June 2006 Polarization effects: EAPSM vs. TT EAPSM
Author Affiliations +
Proceedings Volume 6281, 22nd European Mask and Lithography Conference; 628109 (2006) https://doi.org/10.1117/12.692729
Event: 22nd European Mask and Lithography Conference, 2006, Dresden, Germany
Abstract
Today novel RET solutions are gaining more and more attention from the lithography community that is facing new challenges in attempting to meet the new requirement of the SIA roadmap. Immersion, high NA, polarization, and mask topography, are becoming common place terminology as lithographers continue to explore these areas. Here with, we compare a traditional 6% MoSi based EAPSM reticle and a high transmission solution made of a SiON/Cr film stack. Insights into the manufacturability of high transmission material are provided. Test patterns have been analyzed to determine the overall impact of imaging performance when used with immersion scanners and polarized light. Some wafer results provide reliability of simulations, which are used to make further investigation on polarization and immersion effects.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nicoló Morgana, Will Conley, Michael Cangemi, Marc Cangemi, and Bryan S. Kasprowicz "Polarization effects: EAPSM vs. TT EAPSM", Proc. SPIE 6281, 22nd European Mask and Lithography Conference, 628109 (21 June 2006); https://doi.org/10.1117/12.692729
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KEYWORDS
Photomasks

Polarization

Etching

Manufacturing

Lithography

Optical lithography

Plasma etching

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