CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 6185 > Article
Paper
21 April 2006 Integration of generic and application-specific optical printed circuit boards and VLSI photonic integrated circuits
El-Hang Lee, S. G. Lee, B. H. O, S. G. Park, K. H. Kim
Author Affiliations +
Proceedings Volume 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration; 61850K (2006) https://doi.org/10.1117/12.673846
Event: SPIE Photonics Europe, 2006, Strasbourg, France
Abstract
This paper presents results of our work on the design, fabrication ad integration of a generic form of optical printed circuit boards (O-PCBs) by lamination of an optical layer board and an electrical layer board. This is a part of our ongoing work on the micro/nano-scale design, fabrication and integration of optical waveguide arrays and devices for optical printed circuit board (O-PCBs) and VLSI micro/nano-photonic integrated circuit application. The optical layer consists of planar optical integrated circuits and arrays of waveguides and photonic devices of various dimensions and characteristics to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards. The electrical layer consists of electrical wires and circuits of various functions to drive the light sources, photondetectors, modulators, and others to assist the optical functions. We use lamination technique to assemble the two layers to form an O-PCB. The advantages of lamination include the processing simplification, cost reduction, fabrication of compact devices, and the reduction of alignment problem among others. VLSI micro/nano-photonic integrated circuits can be realized by using photonic crystals and plasmonic structures to perform the optical functions on a chip scale. We describe design approaches to generic and application specific O-PCBs and lamination process as a way of integrating and assembling an optical printed circuit board as a platform for VLSI photonic chip.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
El-Hang Lee, S. G. Lee, B. H. O, S. G. Park, and K. H. Kim "Integration of generic and application-specific optical printed circuit boards and VLSI photonic integrated circuits", Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 61850K (21 April 2006); https://doi.org/10.1117/12.673846
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 10 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Waveguides
Integrated optics
Very large scale integration
Optical alignment
Optical printed circuit boards
Computing systems
Photonic crystals
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top