High-density parallel optical interconnection for 10Tbps interconnection in high-speed memory test systems

Toshiyuki Okayasu; Yusuke Hayase; Atsushi Ono; Daisuke Watanabe; Hajime Mori; Takehiko Nomura

doi:10.1117/12.650091

3 March 2006 High-density parallel optical interconnection for 10Tbps interconnection in high-speed memory test systems

Toshiyuki Okayasu, Yusuke Hayase, Atsushi Ono, Daisuke Watanabe, Hajime Mori, Takehiko Nomura

Proceedings Volume 6124, Optoelectronic Integrated Circuits VIII; 61240M (2006) https://doi.org/10.1117/12.650091
Event: Integrated Optoelectronic Devices 2006, 2006, San Jose, California, United States

Abstract

High-density parallel optical interconnection is introduced as a solution to solve transmission bottlenecks in memory test system. A protocol-free parallel optical module capable of transmitting from DC to 34.1 Gbps (4.267 Gbps × 8 ch) has been developed. Data transmission throughput density per unit volume of 19 Gbps/cc and random jitter of less than 3ps rms are achieved. And also, we will describe the manufacturing process, the module testing, and self-diagnosis for optical transmission system. Furthermore, high-density optical connector and high-density optical fiber cable suited for mechanical requirements of Memory Test System have been developed.

Citation Download Citation

Toshiyuki Okayasu, Yusuke Hayase, Atsushi Ono, Daisuke Watanabe, Hajime Mori, and Takehiko Nomura "High-density parallel optical interconnection for 10Tbps interconnection in high-speed memory test systems", Proc. SPIE 6124, Optoelectronic Integrated Circuits VIII, 61240M (3 March 2006); https://doi.org/10.1117/12.650091

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KEYWORDS

Connectors

Transmittance

Optics manufacturing

Optical fiber cables

Modulation

Optical interconnects

Receivers

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