A novel elevating structure design applied on the motion behavior analysis of micro optical devices by CMOS-MEMS Process

Chien-Chung Tsai; Zhen-Hao Fan; Pei-Hao Lin

doi:10.1117/12.645027

23 January 2006 A novel elevating structure design applied on the motion behavior analysis of micro optical devices by CMOS-MEMS process

Chien-Chung Tsai, Zhen-Hao Fan, Pei-Hao Lin

Author Affiliations +

Proceedings Volume 6113, MEMS/MOEMS Components and Their Applications III; 61130N (2006) https://doi.org/10.1117/12.645027
Event: MOEMS-MEMS 2006 Micro and Nanofabrication, 2006, San Jose, California, United States

Abstract

The paper proposed a novel curb structure to elevate the micro optical devices by the driving force of micro array thermal actuator, MATA. The effects of spring structure and curb structure on the maximum displacements and the variation of surface flatness of the elevated micro mirror varied with operation voltage are investigated. The motion behaviors of the elevated micro mirror are stimulated and analyzed to get the maximum displacement and inclined angle of the device. The results demonstrate the wider width, longer pitch and more pitch numbers of spring structure are; the maximum displacement of the elevated micro mirror is larger. Compared the effects of spring structure and curb structure on the maximum displacement of the elevated micro mirror, there are more influence on the variation of maximum displacement due to the varied spring structure than the varied curb structure. On the other hand, the variation of surface flatness of the elevated micro mirror is more significant by the varied pitch number of spring structure and the varied width of curb structure. The maximum displacement and inclined angle of proposed micro optical device are 58.6μm and 17.04°C, respectively.

Citation Download Citation

Chien-Chung Tsai, Zhen-Hao Fan, and Pei-Hao Lin "A novel elevating structure design applied on the motion behavior analysis of micro optical devices by CMOS-MEMS process", Proc. SPIE 6113, MEMS/MOEMS Components and Their Applications III, 61130N (23 January 2006); https://doi.org/10.1117/12.645027

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