Paper
23 January 2006 Fabrication of micro-chambers and enclosures using synchronous localized electro-deposition
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Abstract
The presented work demonstrates that the ability of localized electro-deposition to fabricate truly three dimensional microstructures does not only require accurate control of the deposition electrode, but also demands a fabrication strategy that highly affects deposition resolution, characteristics, and the economical return of the technology. For this purpose, a synchronous deposition strategy is proposed utilizing two tip displacement algorithms. Both algorithms view three dimensional microstructures as stacks of lateral trajectories forming the structure's boundaries. In the first algorithm the synchronized tip positioning is implemented using tip stepped displacement, where the tip is moved from a point on a deposition trajectory to a neighboring location only upon sufficient deposition at the current location. The second algorithm, however, is implemented using continuous electrode displacement that allows deposition at all points along a trajectory while the tip is kept in continuous motion. The proposed synchronous deposition algorithms are demonstrated through the fabrication of micro-chambers and enclosures of arbitrary size and geometries. Comparison between both algorithms is concluded from SEM images of deposited structures in terms of deposit characteristics and strategy artifacts. The stepped displacement algorithm provides a shorter fabrication time but suffers from stepping artifacts. The continuous displacement algorithm, on the other hand, provides smooth boundaries but requires longer fabrication time that depends on the displacement speed of the deposition tip relative to the deposition growth rate.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. A. Said "Fabrication of micro-chambers and enclosures using synchronous localized electro-deposition", Proc. SPIE 6109, Micromachining and Microfabrication Process Technology XI, 61090E (23 January 2006); https://doi.org/10.1117/12.645835
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KEYWORDS
Light emitting diodes

Electrodes

Control systems

Polishing

Copper

3D microstructuring

Ions

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