A new laser bonding method of anisotropic conductive films in flat panel display and in semiconductor packaging

Gi-Jung Nam; Meong-Hui Seo; Kwang-Hyun Ryu; No-Heung Kwak

doi:10.1117/12.650573

1 March 2006 A new laser bonding method of anisotropic conductive films in flat panel display and in semiconductor packaging

Gi-Jung Nam, Meong-Hui Seo, Kwang-Hyun Ryu, No-Heung Kwak

Author Affiliations +

Proceedings Volume 6107, Laser-based Micropackaging; 610701 (2006) https://doi.org/10.1117/12.650573
Event: Lasers and Applications in Science and Engineering, 2006, San Jose, California, United States

Abstract

Anisotropic conductive films (ACFs) consist of conducting particles and adhesive resins, and have been widely used for packaging technologies in flat panel displays (FPDs) such as liquid crystal displays (LCDs) and plasma display panels (PDPs). Various packaging technologies such as film on glass (FOG), chip on flex (COF) and Chip on glass (COG) using ACFs have been currently carried out by using a hot plate as a heat source for cure. But this method is difficult to meet the requirement of fine pitch capability and to make the flat panel displays smaller, lighter and thinner because of inhomogeneous thermal distribution of hot plate and thermal expansion of a film. New ACF bonding processes by making use of high power diode laser have been proposed and investigated experimentally. Laser ACF bonding is worthy of attention because of a considerable reduction of the total process time due to the rapid reach of curing temperature. Laser ACF bonding also eliminates problem associated with a deterioration of contact reliability due to the thermal expansion caused by the hot plate surface, when temperature is rising

Citation Download Citation

Gi-Jung Nam, Meong-Hui Seo, Kwang-Hyun Ryu, and No-Heung Kwak "A new laser bonding method of anisotropic conductive films in flat panel display and in semiconductor packaging", Proc. SPIE 6107, Laser-based Micropackaging, 610701 (1 March 2006); https://doi.org/10.1117/12.650573

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