Tapered fused bundle coupler package for reliable high optical power dissipation

François Séguin; Alexandre Wetter; Lilian Martineau; Mathieu Faucher; Claude Delisle; Stéphane Caplette

doi:10.1117/12.661254

23 February 2006 Tapered fused bundle coupler package for reliable high optical power dissipation

François Séguin, Alexandre Wetter, Lilian Martineau, Mathieu Faucher, Claude Delisle, Stéphane Caplette

Proceedings Volume 6102, Fiber Lasers III: Technology, Systems, and Applications; 61021N (2006) https://doi.org/10.1117/12.661254
Event: Lasers and Applications in Science and Engineering, 2006, San Jose, California, United States

Abstract

Light absorption in structural adhesives constitutes the main source of heat in tapered fused bundle (TFB) devices. Efficient heat dissipation solutions were developed by studying these thermal loads. The relative merits of transparent vs. opaque package designs were established experimentally. In the former, light escapes without being absorbed by the package walls, whereas in the latter, the spurious optical signal is directly absorbed and dissipated. The fact that heat is generated directly in the adhesive largely favors the opaque package, which offers more efficient heat extraction. By using a thermally conductive package, a temperature rise of 1.1°C per Watt of dissipated power was measured. These numbers demonstrate that passive heat sinking at 20°C is sufficient to allow reliable operation up to 45Watts of dissipated power (1kW with 0.2dB optical loss) without compromising long-term reliability.

Citation Download Citation

François Séguin, Alexandre Wetter, Lilian Martineau, Mathieu Faucher, Claude Delisle, and Stéphane Caplette "Tapered fused bundle coupler package for reliable high optical power dissipation", Proc. SPIE 6102, Fiber Lasers III: Technology, Systems, and Applications, 61021N (23 February 2006); https://doi.org/10.1117/12.661254

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