Paper
29 April 2005 Sub-pixel precise image analysis in the industrial environment
Alexey S. Potapov, Vadim R. Luciv, Igor A. Malyshev
Author Affiliations +
Proceedings Volume 5831, Eighth International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering; (2005) https://doi.org/10.1117/12.619700
Event: Eighth International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering, 2004, St. Petersburg, Russian Federation
Abstract
We present an approach to automatic sup-pixel precise measurement of the positions and local orientations of the holes and edge peculiarities of complex shapes in a sheet metal. The sub-pixel precision of measurement is reached by means of a model-based image analysis. A correlation based measure is introduced to obtain the measurement results invariant to illumination conditions. The correlation is calculated of the vector models and the brightness gradient field of the image region in which the local object of interest is expected to be found. The vector models are derived from the CAD-descriptions of industrial components. The task is solved in the context of photogrammetric 3D measurements for the quality control in the industrial environment.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alexey S. Potapov, Vadim R. Luciv, and Igor A. Malyshev "Sub-pixel precise image analysis in the industrial environment", Proc. SPIE 5831, Eighth International Workshop on Nondestructive Testing and Computer Simulations in Science and Engineering, (29 April 2005); https://doi.org/10.1117/12.619700
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
3D modeling

Cameras

Image analysis

Metals

Solid modeling

3D metrology

Computer aided design

Back to Top