Moiré interferometry for engineering and science

Daniel Post

doi:10.1117/12.611597

14 February 2005 Moire interferometry for engineering and science

Daniel Post

Proceedings Volume 5776, Eighth International Symposium on Laser Metrology; (2005) https://doi.org/10.1117/12.611597
Event: Eighth International Conference on Laser Metrology, 2005, Merida, Mexico

Abstract

Moire interferometry provides contour maps of in-plane displacement fields with high sensitivity and high spatial resolution. It has matured rapidly as an invaluable tool for engineering analyses, proved by many industrial and scientific applications. With the typical reference grating frequency of 2400 lines/mm, the contour interval is 0.417 μm displacement per fringe order. For microscopic moire interferometry, sensitivity corresponding to 17 nm per contour has been achieved. Reliable normal strains and shear strains are extracted from the displacement data for bodies under mechanical, thermal and hydrostatic loading. The characteristics and basic concepts of moire interferometry are reviewed. Significant examples from the fields of composite materials, fracture mechanics, electronic packaging and biomechanics are presented.

Citation Download Citation

Daniel Post "Moire interferometry for engineering and science", Proc. SPIE 5776, Eighth International Symposium on Laser Metrology, (14 February 2005); https://doi.org/10.1117/12.611597

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available