Evaluation of the mechanical properties of the materials in MEMS using an optical profiler

Haifei Bao; Deren Lu; Minghao Zhao

doi:10.1117/12.607902

8 December 2004 Evaluation of the mechanical properties of the materials in MEMS using an optical profiler

Haifei Bao, Deren Lu, Minghao Zhao

Proceedings Volume 5774, Fifth International Conference on Thin Film Physics and Applications; (2004) https://doi.org/10.1117/12.607902
Event: Fifth International Conference on Thin Film Physics and Applications, 2004, Shanghai, China

Abstract

In this paper an optical method using an optical profiler to evaluate the mechanical properties of the materials in MEMS is presented. As an example, a kind of cantilever plate-mass structure is prepared and measured to determine Young’s modulus of single crystal silicon and the residual stress of the thermal oxide SiO₂ on it. An accurate deflection along the surface of the cantilever plate due to the action of residual stress or gravity can be easily obtained. The resolutions of the deflection and the load can be expected to be better than 1 nm and 0.1 μN respectively. The Young’s modulus and the residual stress at 163Gpa and -280Mpa, respectively.

Citation Download Citation

Haifei Bao, Deren Lu, and Minghao Zhao "Evaluation of the mechanical properties of the materials in MEMS using an optical profiler", Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); https://doi.org/10.1117/12.607902

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