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We report a novel application of the solid electrolyte K-Cu-I thin film for preparing copper nanowires. The K-Cu-I film was prepared by depositing a mixture of KI and CuI powders on a heated glass substrate in vacuum and had a copper ion conductivity of 1.5x10-3Ω-1cm-1 at 540K. At 540K, being applied a direct current (DC) electric field of 1.0x104 V/m, the copper ions migrated toward cathode through the K-Cu-I film and congregated to form nanowires at the edge of the cathode. The copper nanowires were about 40~100nm in diameter and several micrometers in length.
Shuo Shi,Jia-Lin Sun,Guo-Sheng Zhang,Jian-Hong Zhang,Ji-Hua Guo, andZheng-Ping Wang
"A novel application of the solid electrolyte thin film for preparing copper nanowires", Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); https://doi.org/10.1117/12.607384
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Shuo Shi, Jia-Lin Sun, Guo-Sheng Zhang, Jian-Hong Zhang, Ji-Hua Guo, Zheng-Ping Wang, "A novel application of the solid electrolyte thin film for preparing copper nanowires," Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); https://doi.org/10.1117/12.607384