Influence of material on process focus budget and process window of 80nm DRAM devices

Sung Won Choi; SukJoo Lee; Jangho Shin; Sang-Gyun Woo; HanKu Cho; Joo-Tae Moon

doi:10.1117/12.600166

10 May 2005 Influence of material on process focus budget and process window of 80nm DRAM devices

Sung Won Choi, SukJoo Lee, Jangho Shin, Sang-Gyun Woo, HanKu Cho, Joo-Tae Moon

Proceedings Volume 5752, Metrology, Inspection, and Process Control for Microlithography XIX; (2005) https://doi.org/10.1117/12.600166
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

A new type of focus monitoring mask, multiple phase-phase shift mask (MP-PSM), has been designed, and the focus budget of a lithography process was investigated. MP-PSM was used to identity focus controllability of several scanners and was able to detect focus change smaller then 20 nm. We also investigated the difference in focus variation across a wafer between double side polished wafers and single side polished wafers. A comparative study of focus controllability of a scanner using 80 nm node DRAM pattern showed that the focus controllability of a scanner was directly affected by wafer type. Using double side polished wafers increased the process window.

Citation Download Citation

Sung Won Choi, SukJoo Lee, Jangho Shin, Sang-Gyun Woo, HanKu Cho, and Joo-Tae Moon "Influence of material on process focus budget and process window of 80nm DRAM devices", Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); https://doi.org/10.1117/12.600166

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