Reliability of a thermally actuated MEMS VOA for optical component applications

Ryan M. Hickey; Robert E. Mallard; James Wylde; Thomas Shepperd; John Panton

doi:10.1117/12.590835

22 January 2005 Reliability of a thermally actuated MEMS VOA for optical component applications

Ryan M. Hickey, Robert E. Mallard, James Wylde, Thomas Shepperd, John Panton

Proceedings Volume 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV; (2005) https://doi.org/10.1117/12.590835
Event: MOEMS-MEMS Micro and Nanofabrication, 2005, San Jose, California, United States

Abstract

This paper will present the concluding results of a comprehensive study aimed at developing a model for predicting the overall reliability of an asymmetric thermal actuator. This actuator is designed for co-packaged use as a variable optical attenuator (VOA) within a 10 Gbps optical receiver. This paper will address the limitations of a previously reported vision recognition system. It is shown that the electrical resistance change correlates well with the displacement change over time, and as a result, simple in-situ resistance monitoring for degradation detection can easily be realized. The novel methodology employed to estimate the lifetime performance of the MEMS VOA is also presented; whereby, the accelerated ageing wearout model derived from 93,600 device hours is combined with the module characteristics, and all associated error coefficients in a Monte Carlo simulation. Simulation results will provide the end user with a 3 sigma confidence prediction of the receiver over-life attenuation curve and all end of life conditions associated with the MEMS component. It will be demonstrated that when designed properly, a thermal actuator will provide predictable accurate and reliable stability over life.

Citation Download Citation

Ryan M. Hickey, Robert E. Mallard, James Wylde, Thomas Shepperd, and John Panton "Reliability of a thermally actuated MEMS VOA for optical component applications", Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); https://doi.org/10.1117/12.590835

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