A novel absorptive thin film design for laser welding in optoelectronic device capsulation

Shaoji Jiang; Weiduo Li; Hezhou Wang

doi:10.1117/12.579698

13 January 2005 A novel absorptive thin film design for laser welding in optoelectronic device capsulation

Shaoji Jiang, Weiduo Li, Hezhou Wang

Proceedings Volume 5629, Lasers in Material Processing and Manufacturing II; (2005) https://doi.org/10.1117/12.579698
Event: Photonics Asia, 2004, Beijing, China

Abstract

In this paper, a kind of absorptive thin film, for the first time, was used in laser welding of SiO₂, Si and L_iN_bO₃. This absorptive thin film of three-layer metal-dielectric-metal structure is designed for further reducing the high reflectance of the Nd:YAG laser beam in the surface of the tin layer that is utilized as solder between the transparent parent materials. The actual absorption exceeds 99%. This combination of absorber and solder transformed the laser energy into heat effectively and decreased the minimum necessary incident laser power transmitting through the transparent parent materials. As a result, the damage of the parent materials, which is suffered from laser transmission, is avoided; on the other hand, the laser power is of full utilization and saved.

Citation Download Citation

Shaoji Jiang, Weiduo Li, and Hezhou Wang "A novel absorptive thin film design for laser welding in optoelectronic device capsulation", Proc. SPIE 5629, Lasers in Material Processing and Manufacturing II, (13 January 2005); https://doi.org/10.1117/12.579698

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