Paper
11 November 2004 Dry machining characterization simulations and experiments for new cutting tool design with embedded heat pipe
Richard Y. Chiou, Lin Lu, Jim S. J. Chen, Mark T. North
Author Affiliations +
Proceedings Volume 5605, Intelligent Systems in Design and Manufacturing V; (2004) https://doi.org/10.1117/12.581226
Event: Optics East, 2004, Philadelphia, Pennsylvania, United States
Abstract
The results of dry machining characterization simulations and experiments for new design technology of using a heat pipe installed in a cutting tool to remove the heat produced at the tool-chip interface which causes thermal damage and tool wear are presented in the paper. Analysis of the results by a heat transfer finite element model indicates that the particular heat pipe used was capable of removing heat with a significant reduction in the rise of the tool-chip interface temperature above the temperature in the surrounding environment at steady operating conditions. Measurements of the variation of the tool insert temperature with time are reported. Both cases, with and without heat-pipe, were considered. In the end the project yields dry machining characterization on influence of embedded heat pipe on mechanical properties of insert and workpiece, tool-chip interface temperature, and tool wear. The results of this study are useful for the cutting tool design and implementation in environmentally conscious manufacturing applications.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard Y. Chiou, Lin Lu, Jim S. J. Chen, and Mark T. North "Dry machining characterization simulations and experiments for new cutting tool design with embedded heat pipe", Proc. SPIE 5605, Intelligent Systems in Design and Manufacturing V, (11 November 2004); https://doi.org/10.1117/12.581226
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Interfaces

Finite element methods

Temperature metrology

Manufacturing

Heat flux

3D modeling

Thermal effects

Back to Top