Passive fiber chip coupling of polymer PLC devices using hot embossing technique

Jin Tae Kim; Choon-Gi Choi

doi:10.1117/12.556710

14 October 2004 Passive fiber chip coupling of polymer PLC devices using hot embossing technique

Jin Tae Kim, Choon-Gi Choi

Proceedings Volume 5523, Current Developments in Lens Design and Optical Engineering V; (2004) https://doi.org/10.1117/12.556710
Event: Optical Science and Technology, the SPIE 49th Annual Meeting, 2004, Denver, Colorado, United States

Abstract

The optical interconnection between fibers and optical waveguides has been the most important factor for low-cost packaging of multi-channel PLC-type optical devices. Recently, polymer based PLC-type optical devices have been considered as an alternative fabrication method and are particularly attractive because of their satisfactory light guiding characteristics and easy fabrication process. In this study, a novel micro-mechanical passive alignment method for multi-channel polymer PLC devices has been designed and fabricated using a hot embossing technique. The main design issue is simultaneous fabrication of micro channels for single-mode waveguides and micro-pedestals for passive alignment on a polymer PLC surface in one step by hot embossing. Since the hot embossing process uses wet-etched silicon mould for pedestals, and alignment pits on silicon optical bench (SiOB) are also wet-etched in KOH solution, optical alignment was achieved through the simple insertion of micro pedestals into the alignment pits on SiOB. The hot embossed waveguide and passive alignment pedestals have been shown an accuracy of ± 0.5 μm. The propagation loss of fabricated single-mode polymer PLC was 0.83 dB/cm at a wavelength of 1550 nm, and passively aligned polymer PLC device with an accurate SiOB showed an average 0.67 dB coupling loss.

Citation Download Citation

Jin Tae Kim and Choon-Gi Choi "Passive fiber chip coupling of polymer PLC devices using hot embossing technique", Proc. SPIE 5523, Current Developments in Lens Design and Optical Engineering V, (14 October 2004); https://doi.org/10.1117/12.556710

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available