Optical MEMS components fabrication using micromachning of (111)-oriented silicon wafers

Dana Cristea; Elena Manea; Mihai Kusko

doi:10.1117/12.545022

16 August 2004 Optical MEMS components fabrication using micromachning of (111)-oriented silicon wafers

Dana Cristea, Elena Manea, Mihai Kusko

Proceedings Volume 5455, MEMS, MOEMS, and Micromachining; (2004) https://doi.org/10.1117/12.545022
Event: Photonics Europe, 2004, Strasbourg, France

Abstract

This paper presents the experiments we have performed to obtain freestanding SiO₂ and c-Si based microphotonic components by anisotropic wet etching of silicon (111) wafers. The process is simpler than surface micromachining. It requires only one grown or deposited layer and one mask for SiO₂ structure, or two masks for c-Si structures. Moreover, the technique provides plan-parallel microstructure with very flat (111) surfaces, useful for photonic components like micromirrors and waveguides. Movable SiO₂ and silicon-based micromirrors and waveguides with very smooth surfaces were obtained by anisotropic etching in a KOH solution combined with plasma etching. The possible applications of SiO₂ and silicon based freestanding structures include devices for optical communications and bio- or chemo-optical sensors.

Citation Download Citation

Dana Cristea, Elena Manea, and Mihai Kusko "Optical MEMS components fabrication using micromachning of (111)-oriented silicon wafers", Proc. SPIE 5455, MEMS, MOEMS, and Micromachining, (16 August 2004); https://doi.org/10.1117/12.545022

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