Paper
24 May 2004 Contact hole edge roughness: circles vs. stars
Andrew Habermas, Qingyou Lu, David Chase-Colin, Michael Har-Zvi, Aviram Tam, Omer Sagi
Author Affiliations +
Abstract
The edge roughness of straight lines has received intense focus in the past, whereas the edge roughness of contact holes has been relatively unexplored. Reductions in contact hole roughness can be shown to offer improvements in electrical breakdown voltages, or potentially the opportunity for reduced cellsize. This paper introduces two CD-SEM algorithms for characterizing the amplitude and frequency of contact hole edge roughness. When combined, these two metrics proved capable of detecting differences within four wafer pairs with varying dimension and processing. Increased roughness amplitude was shown to correlate to electrical breakdown failures.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andrew Habermas, Qingyou Lu, David Chase-Colin, Michael Har-Zvi, Aviram Tam, and Omer Sagi "Contact hole edge roughness: circles vs. stars", Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); https://doi.org/10.1117/12.537537
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CITATIONS
Cited by 6 scholarly publications and 2 patents.
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KEYWORDS
Etching

Semiconducting wafers

Edge roughness

Photoresist processing

Electrical breakdown

Metals

Cadmium sulfide

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