Lead-free technologies for electronic equipment assembly

Ryszard Kisiel

doi:10.1117/12.532363

24 October 2003 Lead-free technologies for electronic equipment assembly

Ryszard Kisiel

Proceedings Volume 5125, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments; (2003) https://doi.org/10.1117/12.532363
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2002, 2002, Wilga, Poland

Abstract

The electronic industry is now going through a difficult period. The companies must cut costs, regroup and innovate. Environmentally friendly production from cradle-to-grave can be an essential element of future manufacturing trends. Recognizing leaf-free technology implementation it is necessary to consider the following elements: solder, printed circuit board and component finish or assembly technology. In the paper, the [hysical properties of chosen Pb-free solders were presented. There were analyzed the advantages and disadvantages of two PCB assembly methods: lead free soldering and gluing by condictive adhesive. The comparison of electrical and mechanical properties of joints made by Pb-free solders and two types of conductive adhesives were presented too. It was concluded that the exploitation parameters of joints made by Pb-free solders are proper for PCB assembly. Conductive adhesives may replace solders in these applications were the low value of joint resistance is not critical.

Citation Download Citation

Ryszard Kisiel "Lead-free technologies for electronic equipment assembly", Proc. SPIE 5125, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments, (24 October 2003); https://doi.org/10.1117/12.532363

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