Paper
14 October 2003 Finite element analysis of structures with surface-bonded piezoelectric patches
Dipak K. Maiti, E. Hemalatha, J. V. Kamesh, A. R. Upadhya
Author Affiliations +
Proceedings Volume 5062, Smart Materials, Structures, and Systems; (2003) https://doi.org/10.1117/12.514470
Event: Smart Materials, Structures, and Systems, 2002, Bangalore, India
Abstract
This paper presents Finite Element analysis of structures with surface bonded piezoelectric patches. The objective of the present investigation is to develop layered piezoelectric elements which can be combined with the plate bending elements in a general purpose software such as MSC/NASTRAN, as a sensor/actuator for the analysis of smart structures. After thorough validation, numerical results are generated for various piezo-electric parameters.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dipak K. Maiti, E. Hemalatha, J. V. Kamesh, and A. R. Upadhya "Finite element analysis of structures with surface-bonded piezoelectric patches", Proc. SPIE 5062, Smart Materials, Structures, and Systems, (14 October 2003); https://doi.org/10.1117/12.514470
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KEYWORDS
Actuators

Sensors

Finite element methods

Smart structures

Electric field sensors

Ferroelectric polymers

Software development

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