Supercritical resist dry technique for electron-beam projection lithography (EPL)

George Petricich; Kohei Suzuki; Jun Munemasa; Tetsuya Yoshikawa; Nobuyuki Kawakami; Sumito Shimizu; Manabu Watanabe

doi:10.1117/12.484990

16 June 2003 Supercritical resist dry technique for electron-beam projection lithography (EPL)

George Petricich, Kohei Suzuki, Jun Munemasa, Tetsuya Yoshikawa, Nobuyuki Kawakami, Sumito Shimizu, Manabu Watanabe

Proceedings Volume 5037, Emerging Lithographic Technologies VII; (2003) https://doi.org/10.1117/12.484990
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

A single-layer resist process for a technology nodes at or below 65nm utilizing a novel supercritical dry technique and Electron-beam Projection Lithography (EPL) technology is discussed. EPL is inhernelty advantageous in imaging sub-65nm geometries with high aspect ratios. Pattern collapse of these high aspect ratio (resist) structures, however, is a critical and limiting issue. By employing our novel supercritical carbon dioxide (SCCO2) dry technique, 70nm and 60nm lines and spaces patterns with a resist thickness of 250nm, whose aspect ratio is 3.5 and 4.2 respectively, have been successfully demonstrated without resist pattern collapse.

Citation Download Citation

George Petricich, Kohei Suzuki, Jun Munemasa, Tetsuya Yoshikawa, Nobuyuki Kawakami, Sumito Shimizu, and Manabu Watanabe "Supercritical resist dry technique for electron-beam projection lithography (EPL)", Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); https://doi.org/10.1117/12.484990

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