Paper
16 January 2003 High Q RF coils on silicon integrated circuits
Christopher L. Chua, David K. Fork, Koenraad Van Schuylenbergh, Jeng-Ping Lu
Author Affiliations +
Abstract
We report on out-of-plane micro-machined inductors exhibiting record high quality factors (Q) on silicon integrated circuits. The coils are made by three-dimensional self-assembly of stress-engineered structures fabricated with standard semiconductor batch processing techniques. Coils fabricated on low resistance CMOS-compatible silicon exhibit quality factors of over 70 at 1 GHz. BiCMOS test oscillators utilizing these micro-machined coils show significant phase noise reduction over similar oscillators using conventional spiral coils.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christopher L. Chua, David K. Fork, Koenraad Van Schuylenbergh, and Jeng-Ping Lu "High Q RF coils on silicon integrated circuits", Proc. SPIE 4981, MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II, (16 January 2003); https://doi.org/10.1117/12.472875
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CITATIONS
Cited by 5 scholarly publications and 3 patents.
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KEYWORDS
Oscillators

Silicon

Metals

Plating

Semiconducting wafers

Copper

Integrated circuits

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